? semiconductor components industries, llc, 2014 may, 2014 ? rev. 0 1 publication order number: nsr0170h/d NSR0170HT1G schottky barrier diode schottky barrier diodes are optimized for very low forward voltage drop and low leakage current and are used in a wide range of dc?dc converter, clamping and protection applications in portable devices. nsr0170h in a sod?323 small footprint package enables designers to meet the challenging task of achieving higher efficiency designs and meeting reduced board space requirements. features ? very low forward voltage drop ? 560 mv @ 10 ma ? low reverse current ? 25 na @ 50 v v r ? 70 ma of continuous forward current ? power dissipation of 180 mw with minimum trace ? very high switching speed ? low capacitance ? ct = 2 pf ? nsvr prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant typical applications ? automotive modules ? buck and boost dc?dc converters ? reverse voltage and current protection ? clamping & protection maximum ratings rating symbol value unit reverse voltage v r 70 v forward current (dc) i f 70 ma non?repetitive peak surge forward current i fsm 100 ma esd rating: human body model machine model esd class 2 class m3 stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 70 v schottky barrier diode 1 cathode 2 anode http://onsemi.com device package shipping ? ordering information NSR0170HT1G sod?323 (pb?free) 3000 / tape & ree l ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. sod?323 case 477 q = specific device code m = month code = pb?free package marking diagram 1 2 q m nsvr0170ht1g sod?323 (pb?free) 3000 / tape & ree l (note: microdot may be in either location)
NSR0170HT1G http://onsemi.com 2 thermal characteristics characteristic symbol min typ max unit thermal resistance junction?to?ambient (note 1) total power dissipation @ t a = 25 c r ja p d 680 180 c/w mw thermal resistance junction?to?ambient (note 2) total power dissipation @ t a = 25 c r ja p d 440 280 c/w mw junction and storage temperature range t j , t stg ?55 to +150 c 1. mounted onto a 4 in square fr?4 board 10 mm sq. 1 oz. cu 0.06? thick single sided. operating to steady state. 2. mounted onto a 4 in square fr?4 board 1 in sq. 1 oz. cu 0.06? thick single sided. operating to steady state. electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit reverse leakage (v r = 50 v) (v r = 70 v) i r 25 ? 90 3.0 na a forward voltage (i f = 1.0 ma) (i f = 10 ma) (i f = 15 ma) v f 340 560 650 390 640 730 mv total capacitance (v r = 0 v, f = 1 mhz) ct 2.0 pf figure 1. forward voltage figure 2. leakage current v f , forward voltage (v) v r , reverse voltage (v) 1.6 1.0 0.8 0.6 0.2 0 0.001 0.01 0.1 1 10 100 1000 70 60 50 40 30 20 10 0 0.00001 0.0001 0.001 0.01 0.1 10 100 figure 3. total capacitance v r , reverse voltage (v) 80 60 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 i f , forward current (ma) i r , reverse current ( a) c t , total capacitance (pf) 0.4 150 c 125 c ?40 c 85 c 25 c 150 c 125 c ?40 c 85 c 25 c 1 50 70 t a = 25 c 1.2 1.4
NSR0170HT1G http://onsemi.com 3 package dimensions sod?323 case 477?02 issue h h e notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. lead thickness specified per l/f drawing with solder plating. 4. dimensions a and b do not include mold flash, protrusions or gate burrs. 5. dimension l is measured from end of radius. note 3 d 1 2 b e a3 a1 a c note 5 l 1.60 0.063 0.63 0.025 0.83 0.033 2.85 0.112 h e dim min nom max millimeters a 0.80 0.90 1.00 a1 0.00 0.05 0.10 a3 0.15 ref b 0.25 0.32 0.4 c 0.089 0.12 0.177 d 1.60 1.70 1.80 e 1.15 1.25 1.35 0.08 2.30 2.50 2.70 l 0.031 0.035 0.040 0.000 0.002 0.004 0.006 ref 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 min nom max inches *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 nsr0170h/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
|
